SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › DISCO plans to invest $276 million to build new factory
  • 0

DISCO plans to invest $276 million to build new factory

SemiMediaEdit
January 15, 2024

January 15, 2024 /SemiMedia/ -- DISCO Corporation, a Japanese chip manufacturing equipment manufacturer, plans to build a factory in Hiroshima Prefecture, Japan to produce parts for processing chips.

Disco is expected to invest more than 40 billion yen (about 276 million US dollars), and it is planned to start construction as early as 2025. The new factory will produce a cutting wheel for cutting, grinding and polishing. By 2035, the company's production capacity will increase by 14 times.

"We will take measures to make a premissions to cope with the expected demand growth," said Disco CEO Kazuma Sekiya.

It is reported that Disco's share in cutting, grinding and polishing machines ranks first in the world. The company bought a piece of land next to the existing factories in Hiroshima County in 2023, and plans to build three factories around 2035.

Related

DISCO electronic components news Electronic components supplier Electronic parts supplier
Allegro expands isolated gate driver portfolio with bipolar output pass-through IC
Previous
Microchip plans to suspend production for 2 weeks at the Gresham factory
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator