SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › NXP and Foxconn establish joint laboratory
  • 0

NXP and Foxconn establish joint laboratory

SemiMediaEdit
January 2, 2024

January 2, 2024 /SemiMedia/ -- NXP Semiconductors and Hon Hai Technology Group (“Foxconn”) today opened a joint laboratory in the Foxconn Nankan Facility in Taiwan, marking a new milestone in the companies’ strategic collaboration for software-defined electric vehicle development. The joint lab aims to accelerate Foxconn’s efforts in software-defined electric vehicles, leveraging NXP’s comprehensive electrification portfolio and cross-vehicle system solutions using the S32G and S32K3 families for domain and zonal controllers targeting service-oriented gateways, vehicle networking and safe vehicle control.

According to McKinsey & Company , the global automotive software and electronics market is expected to reach $462 billion by 2030, representing a 5.5 percent compound annual growth rate (CAGR) since 2019. The way vehicles are architected, designed, manufactured and experienced is being transformed by software, but this transformation will be an industry-wide effort, requiring close collaboration between diverse stakeholders. The joint laboratory in Taoyuan is a significant example of this team effort. It benefits from bringing together Foxconn’s deep knowledge and experience in electronics manufacturing with NXP’s longstanding expertise in safe and secure system solutions to enable architectural innovation and platforms for electrification, connectivity, and safe automated driving. Together, the companies aim to accelerate the development time for software-defined electric vehicles.

“Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. NXP’s longstanding expertise and leadership in the automotive sector, system understanding, innovative products and laser focus on safety, security and quality provide the foundation for the collaboration we are strengthening today. The joint lab is a significant milestone in the strategic partnership between Foxconn and NXP and we anticipate the results will be adopted in Foxconn’s future developments,” said Zeke Wu, EV E/EA R&D Director at Foxconn E-Business Group.

"We are proud to see the strategic collaboration has moved to the next milestone with the establishment of a joint lab with Foxconn today. The lab will accelerate the progress of electric, software-defined vehicles from talk to reality. The auto industry has to become faster and more efficient, and NXP is pleased to extend its system solutions portfolio to enable electrification, next generation architectures, smart and secure car access systems, and more," said Elton Tsang, Senior Sales Director of NXP Semiconductors

Related

electronic components news Electronic components supplier Electronic parts supplier Foxconn NXP
Renesas joins Automotive Chiplet Research Alliance
Previous
South Korea's semiconductor exports in December 2023 hit a new high YoY growth
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator