December 22, 2023 /SemiMedia/ -- According to reports, Samsung Electronics will receive up to 20 billion yen ($140 million) in subsidies from the Japanese government to build a chip development factory near Tokyo.
The direction of the development factory will focus on the chip packaging field, and the total investment is expected to reach 40 billion yen, of which the Japanese Ministry of Economy, Trade and Industry will subsidize up to half. The factory will be built in Yokohama, which is home to Samsung's Japan R&D center, but the new packaging center will be independent.
Samsung is committed to jointly developing chip packaging technology with Japanese companies. As of October, Samsung said it had received many advanced packaging orders from multiple high-performance computing customers around the world.
