December 1, 2023 /SemiMedia/ -- Amkor Technology recently announced it will spend $2 billion to build a new advanced semiconductor packaging and test facility in Arizona that will package and test Apple chips produced at the nearby chipmaker TSMC facility.
Amkor said it will provide advanced packaging and testing of semiconductors to support high-performance computing, automotive, and communications and when the new facility opens, Apple will be its first and largest customer.
Apple separately confirmed its expanded partnership with Amkor. Amkor said the facility will be the largest U.S. outsourced advanced packaging facility.
Amkor said it had sought funding from the Commerce Department's semiconductor subsidy program and said "these funds will be critical to Amkor’s project moving forward."
Arizona Senator Mark Kelly said "as one of the first advanced packaging facilities in the U.S., this is a huge step forward to reducing dependence on other countries in the microchip supply chain."
