SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Rapidus to produce AI chips for Tenstrent, report says
  • 0

Rapidus to produce AI chips for Tenstrent, report says

SemiMediaEdit
November 17, 2023

November 17, 2023 /SemiMedia/ -- According to reports, Japanese semiconductor company Rapidus has reached a cooperation with Canadian start-up chip company Tenstrent to manufacture AI chips for it.

Tenstorrent was founded in 2016 by Jim Keller, a well-known engineer in the semiconductor industry.

Rapidus President Atsuyoshi Koike said that he plans to open a sales office in Silicon Valley in the United States by the end of March 2024, which will help establish contact with customers before mass production and hopes to expand business globally. Rapidus aims to mass-produce 2nm process chips in Japan in 2027 and is currently seeking cooperation in the industry chain.

Rapidus' 2nm chip R&D/production base in Hokkaido, Japan, started construction in September. The trial production line is scheduled to be launched in April 2025, with the goal of starting mass production in 2027.

Related

electronic components news Electronic components supplier Electronic parts supplier Rapidus Tenstrent
Diodes releases low-power 1.8V, 2.5Gbps, two data lane redriver supporting MIPI D-PHY 1.2 protocols
Previous
Infineon’s revenue in fiscal year 2023 increases by 15% year-on-year
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator