SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › STMicroelectronics launches next-generation NFC controller with built-in secure element
  • 0

STMicroelectronics launches next-generation NFC controller with built-in secure element

SemiMediaEdit
November 9, 2023

November 9, 2023 /SemiMedia/ -- STMicroelectronics has released the ST54L combined NFC controller and secure element IC, which enables mobile devices like smartphones, smart wearables, and tablets to access security-protected contactless ticketing and payment services through the STPay-Mobile platform.

The ST54L can host multiple services including NFC mobile payments, mobile transit ticketing, access-control applications such as Digital Car Key, and converged services requiring an embedded SIM (eSIM). The chip comes loaded with the Thales mobile secure operating system running on the embedded secure element, a proven combination cooperatively developed by ST and Thales.

Compared to the previous-generation devices, the new ST54L chip strengthens NFC RF performance and increases non-volatile storage by over 50 percent to 3.3MByte. The larger memory permits loading extra services on the device while providing generous storage for users to download additional eSIM profiles to support Multiple Enabled Profiles (MEP) or secure applications.

The ST54L is in mass production now and is already part of the newly launched Google Pixel 8 phones. The chip has been validated by several major mobile platform makers, guaranteeing seamless integration by smartphone OEMs.

STMicroelectronics manufactures the ST54L chips using proprietary embedded Flash technology at its own wafer-fabrication plant and relies on a full in-house supply chain.

For more information, please visit http://www.st.com/ST54.

Related

electronic components news Electronic components supplier Electronic parts supplier STMicroelectronics
Vishay to acquire Nexperia's Newport fab for $177 million
Previous
Infineon launches new MCUs to bring high-performance power-efficient machine learning to the edge
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator