SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › STMicroelectronics launches next-generation NFC controller with built-in secure element
  • 0

STMicroelectronics launches next-generation NFC controller with built-in secure element

SemiMediaEdit
November 9, 2023

November 9, 2023 /SemiMedia/ -- STMicroelectronics has released the ST54L combined NFC controller and secure element IC, which enables mobile devices like smartphones, smart wearables, and tablets to access security-protected contactless ticketing and payment services through the STPay-Mobile platform.

The ST54L can host multiple services including NFC mobile payments, mobile transit ticketing, access-control applications such as Digital Car Key, and converged services requiring an embedded SIM (eSIM). The chip comes loaded with the Thales mobile secure operating system running on the embedded secure element, a proven combination cooperatively developed by ST and Thales.

Compared to the previous-generation devices, the new ST54L chip strengthens NFC RF performance and increases non-volatile storage by over 50 percent to 3.3MByte. The larger memory permits loading extra services on the device while providing generous storage for users to download additional eSIM profiles to support Multiple Enabled Profiles (MEP) or secure applications.

The ST54L is in mass production now and is already part of the newly launched Google Pixel 8 phones. The chip has been validated by several major mobile platform makers, guaranteeing seamless integration by smartphone OEMs.

STMicroelectronics manufactures the ST54L chips using proprietary embedded Flash technology at its own wafer-fabrication plant and relies on a full in-house supply chain.

For more information, please visit http://www.st.com/ST54.

Related

electronic components news Electronic components supplier Electronic parts supplier STMicroelectronics
Vishay to acquire Nexperia's Newport fab for $177 million
Previous
Infineon launches new MCUs to bring high-performance power-efficient machine learning to the edge
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
8-inch wafer foundry capacity tightens in 2026 as utilization rises

8-inch wafer foundry capacity tightens in 2026 as utilization rises

January 16, 2026
0
2025 semiconductor revenue reaches $793 billion as AI demand accelerates

2025 semiconductor revenue reaches $793 billion as AI demand accelerates

January 16, 2026
0
South Korea pushes SiC and GaN power chips in foundry drive

South Korea pushes SiC and GaN power chips in foundry drive

January 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator