September 4, 2023 /SemiMedia/ -- TDK Corporation recently announced the start of mass production of its InvenSense SmartSonic™ ICU-20201 ultrasonic time-of-flight (ToF) sensor. InvenSense’s SmartSonic™ family of ultrasonic Time-of-Flight (ToF) sensors integrate a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (system on chip) in a miniature reflowable package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 5m, in any lighting condition, including full sunlight, and independently of the target’s color and optical transparency.

This new sensor gives devices the sensitivity required for accurate obstacle avoidance or proximity/presence sensing, used frequently in robotics and drones, or mobile and computing devices for example. It is also highly relevant in settings that require shelf inventory monitoring or level sensing, such as in smart homes or smart buildings.

The ICU-20201 is the latest release in this sensor family that embeds a more powerful on-chip processor with higher computational power. The enhanced processing capabilities allow fitting and running a wide range of application algorithms on-chip, offloading the system MCU completely.

“Thanks to its enhanced capability, ICU-20201 allows the design of smarter and lower power solutions, making the final product greener, safer, and more aware of the surrounding environment,” said Massimo Mascotto, Director of Product Marketing, InvenSense, a TDK Group company. “Its increased computational capability enables smarter product design and an enhanced end user experience for our customers and partners.”

The ICU-20201, in an ultra-compact package footprint of 3.5 x 3.5 mm², is available now.

For additional information, please visit https://invensense.tdk.com/smartsonic.