September 5, 2023 /SemiMedia/ -- According to reports, Hua Hsu Silicon Materials Co., Ltd. has accelerated product transformation in recent years. In addition to developing the recycled wafer business, it has also joined the third-generation semiconductor silicon carbide (SiC) epitaxy production. It is expected to officially enter the mass production stage from the fourth quarter of 2023 to the first quarter of next year, with a planned annual production capacity of 24,000 pieces.
According to reports, Hua Hsu Silicon’s previous main products were diamonds and silicon accessories. Since 1921, it has gradually been involved in semiconductors, including recycled wafers, silicon carbide wafers/silicon carbide epitaxial wafers.
The company has started mass production of 6-inch SiC wafers in the first quarter of this year and sent them to customers for verification. In addition, SiC epitaxy equipment has arrived at the factory in July, and the production line is scheduled to undergo trial production and adjustment in September, and is expected to start production in the fourth quarter.
Hua Hsu Silicon expects that the production capacity of silicon carbide epitaxy wafers will expand to 48,000 pieces in the third quarter of 2024, and it is expected that the production capacity will expand to 120,000 pieces per year in 2026.