SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Japan aims to exceed $107.4 billion in semiconductor sales in 2030
  • 0

Japan aims to exceed $107.4 billion in semiconductor sales in 2030

SemiMediaEdit
June 7, 2023

Jun 7, 2023 /SemiMedia/ -- According to Bloomberg News, Japan’s Ministry of Economy, Trade and Industry has released a revised strategy for the semiconductor industry, with the goal of increasing Japan’s domestic semiconductor industry sales to 15 trillion yen (about $107.4 billion) by 2030.

Japan's Ministry of Economy, Trade and Industry stated that this strategic goal aims to strengthen the ability to develop and produce cutting-edge semiconductors, because advanced chip manufacturing technology is crucial to national economic security and the development of generative AI technology. This chip industry promotion plan is also expected to create about 463,000 jobs.

"Japanese chip companies are making investments, and we are willing to support these investments and provide the necessary budget to support the development of the chip industry," Japan's economy minister said.

Related

electronic components news Electronic components supplier Electronic parts supplier Japan semiconductor
NXP introduces new, secure, energy-efficient i.MX 91 MCU family
Previous
GF and ST finalize agreement for new 300mm semiconductor fab in France
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator