SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Distribution › TDK releases new high impedance multilayer common mode filter
  • 0

TDK releases new high impedance multilayer common mode filter

SemiMediaEdit
March 15, 2023

Mar. 15, 2023 /SemiMedia/ -- TDK Corporation recently introduced the KCZ1210DH800HRTD25, a new common-mode filter for ultra-high-speed automotive interfaces, which will begin mass production this month in March 2023.

This product is an addition to the KCZ1210DH Series that was released in February 2022. It enables substantial enhancements in noise control functions compared to conventional filters, with an impedance of 1000 Ω at 1 ㎓ and insertion loss of more than 25 db. Due to the recent spread of advanced driver-assistance system (ADAS) implementation, the speed of signal processing has ramped up significantly. Through this, the move to safer and more secure autonomous driving will be achieved. The new TDK filter contributes to preventing errors in high-speed signal processing in relation to front sensing cameras, mmWave radar, LiDAR, etc.

Through TDK's proprietary internal electrode pattern arrangement plus the integrated and sintered configuration of optimal low dielectric materials, this product achieves superior properties, alongside long-term reliability. Furthermore, by adding a conductive resin-based layer to the terminal electrodes, the risk of cracks appearing (due to thermal shocks) is reduced. It also heightens durability to mechanical stresses, such as substrate strains.

The automotive-grade KCZ1210DH800HRTD25 common mode filter is extremely compact. It has 1.25 ㎜ x 1.0 ㎜ x 0.5 ㎜ dimensions. An operating temperature range of -55 to +125 ℃ is supported.

Related

electronic components news Electronic components supplier Electronic parts supplier KCZ1210DH800HRTD25 TDK
Samsung plans to build five new chip factories
Previous
Renesas introduces two new entry-level RA MCU families offering optimal combination of performance, features and value
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Intel lifts margins by selling lower-grade chips as AI demand tightens CPU supply

Intel lifts margins by selling lower-grade chips as AI demand tightens CPU supply

April 28, 2026
0
ROHM launches NFC wireless power chipset for compact wearables

ROHM launches NFC wireless power chipset for compact wearables

April 28, 2026
0
Omdia sees 62.7% semiconductor revenue growth in 2026

Omdia sees 62.7% semiconductor revenue growth in 2026

April 28, 2026
0
Samsung wafer output drops 58%, memory down 18% amid labor dispute

Samsung wafer output drops 58%, memory down 18% amid labor dispute

April 27, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator