Jan. 19, 2023 /SemiMedia/ -- According to Nikkei Asia, Resonac will increase production of materials used in next-generation power semiconductors to five times its current production by 2026.

Resonac, formerly Showa Denko, has a 25% global market share for SiC epitaxial wafers, materials that can extend the range of electric vehicles.

The report pointed out that Resonac produces silicon carbide (SiC) epitaxial wafers in Japan. After expanding its production capacity, the company will have a monthly production capacity of about 50,000 150mm SiC epitaxial wafers, equivalent to about five times the current production capacity.

In addition, the report also pointed out that Resonac will begin mass production of 200mm wafer substrates in 2025. In order to mass-produce large-size substrates, Resonac is considering investing in one of its factories in Saitama, Chiba and Shiga prefectures, with a total investment expected to be tens of billions of yen.