Dec. 14, 2022 /SemiMedia/ -- Soitec officially announced that the expansion project of its wafer industrial park in Pasir Ris, Singapore, has broken ground.

The expanded fab will focus on the production of 300mm SOI wafers, which are used to produce smart phone chips, especially 5G communications, as well as cars and smart devices.

The expansion is planned to be completed in 2024, which will double the annual capacity of Soitec Singapore to about 2 million pieces per year.

The capacity improvement of the Singapore fab is part of Soitec's strategic growth plan, which can meet the growing global demand for wafers, and is also a complementary measure to improve the capacity of the French headquarters. By fiscal year 2026, it will help its global annual capacity to increase to about 4.5 million pieces per year.