SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › India's first wafer fab may break ground in a few months
  • 0

India's first wafer fab may break ground in a few months

SemiMediaEdit
December 7, 2022

Dec. 7, 2022 /SemiMedia/ -- According to reports, ISMC Digital's $3 billion wafer fab in Karnataka, India, may break ground in a few months.

ISMC is a joint venture between Next Orbit Ventures, an investment company in the United Arab Emirates, and Tower Semiconductor in Israel. In addition, Tower Semiconductor has been acquired by Intel for $5.4 billion in early 2022.

The report pointed out that the monthly production capacity of this wafer fab in India is expected to be 40,000 pieces. The initial goal is to produce chips with 65nm process technology, which will be upgraded to 40nm in the future, mainly for automotive and military industries.

After the groundbreaking of ISMC Digital's wafer fab, it will take about four to five years to put it into operation.

Related

electronic components news Electronic components supplier Electronic parts supplier India wafer fab
Intel predicts customer inventory digestion to continue until 2023
Previous
Vishay releases three-phase bridge power modules in compact MTC package, bringing reliable operation at low cost.
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip expands maXTouch M1 controllers for automotive displays up to 42 inches

Microchip expands maXTouch M1 controllers for automotive displays up to 42 inches

January 29, 2026
0
SK hynix said to supply HBM3E exclusively for Microsoft’s Maia 200 AI chip

SK hynix said to supply HBM3E exclusively for Microsoft’s Maia 200 AI chip

January 29, 2026
0
IonQ to acquire US chip foundry SkyWater in $1.8 bln deal

IonQ to acquire US chip foundry SkyWater in $1.8 bln deal

January 29, 2026
0
NXP launches UCODE X chip to support smaller RAIN RFID labels

NXP launches UCODE X chip to support smaller RAIN RFID labels

January 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator