SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › GlobalWafers breaks ground on 300mm wafer fab in Texas
  • 0

GlobalWafers breaks ground on 300mm wafer fab in Texas

SemiMediaEdit
December 5, 2022

Dec. 5, 2022 /SemiMedia/ -- GlobalWafers announced that it broke ground on its Texas factory, which mainly produces 300mm wafers.

The 3.2 million-square-foot facility in Sherman, Texas, the first silicon fab to be built in the United States in more than 20 years, will address a critical shortage of domestic silicon supplies.

GlobalWafers originally planned to increase its wafer production capacity by acquiring Germany's Siltronic, but the transaction was opposed by regulators. Therefore, the company turned its location selection to the United States.

GlobaWafers said the factory will enter volume production within two years.

Related

electronic components news Electronic components supplier Electronic parts supplier globalwafers GlobalWafers Texas
Onsemi sells Niigata factory in Japan to JS Foundry K.K
Previous
Infineon and pmdtechnologies collaborate on i-Tof image sensors to boost performance and optimize costs for 3D camera systems.
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay introduces automotive ambient light sensors for display and lighting control

Vishay introduces automotive ambient light sensors for display and lighting control

June 25, 2026
0
Qualcomm to acquire Modular in nearly $4 billion AI software deal

Qualcomm to acquire Modular in nearly $4 billion AI software deal

June 25, 2026
0
ASE raises 2026 capex to $8.5 billion as AI drives advanced packaging demand

ASE raises 2026 capex to $8.5 billion as AI drives advanced packaging demand

June 25, 2026
0
Rapidus secures additional 150 billion yen funding for 2nm chip production plan

Rapidus secures additional 150 billion yen funding for 2nm chip production plan

June 24, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic components distributor
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator