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UMC breaks ground on new fab in Singapore

SemiMediaEdit
May 25, 2022

UMC recently announced that the construction of the new fab, the P3, in its Singapore Fab12i fab park, has begun to break ground.

It is reported that UMC Singapore's new fab provides 22/28 nanometer process with a total investment of 5 billion US dollars. The monthly production capacity of the first phase is planned to be 30,000 wafers, and mass production is expected to start by the end of 2024.

UMC said that the company has been operating a 12-inch wafer fab in Singapore for more than 20 years, and the Singapore Fab12i fab park is also UMC's advanced special process R&D center. Coupled with the expansion plan of Fab12i, UMC's capital expenditure budget in 2022 will be increased to 3.6 billion US dollars.

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electronic components news Fab12i UMC UMC P3 fab
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