SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Samsung expands FC-BGA production in Vietnam
  • 0

Samsung expands FC-BGA production in Vietnam

SemiMediaEdit
December 27, 2021

According to reports, Samsung Electro-Mechanics approved an expenditure of US$850 million for the production of Flip Chip Ball Grid Array (FC-BGA) equipment and infrastructure in Vietnam. The company will spend this budget before 2023 to build a new FC-BGA production line.

The FC-BGA package is mainly used for CPUs for servers and PCs, and the FC-BGA for server processors is the most expensive among them.

According to industry insider, Samsung expects to produce FC-BGA for PC and network processors, and the customer may be Intel. The company may remove the existing equipment that produces rigid-flex printed circuit boards (RFPCB) at its factory in Vietnam and replace them with FC-BGA equipment.

The insider also said that Samsung is very likely to announce an additional expenditure plan for FC-BGA at the same time to establish another new independent production line. The company currently provides FC-BGA for PCs to a non-Intel customer, but plans to provide them with FC-BGA for servers.

A Samsung Electro-Mechanics spokesperson said that the company is planning to use its Vietnamese subsidiary as a production base for FC-BGA, and its facilities in Suwon and Busan, South Korea, will be used for research and production of high-end FC-BGA.

Related

electronic components news Samsung Electro-Mechanics
Taiyo Yuden suspends operations of its Philippine factory
Previous
Nexperia to expand in Malaysia
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

July 31, 2025
0
Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

July 31, 2025
0
Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

July 31, 2025
0
Littelfuse unveils foldback TVS diode series for advanced DC power protection

Littelfuse unveils foldback TVS diode series for advanced DC power protection

July 30, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator