SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Nikkei: Japanese authorities to allocate $5.2 billion to fund TSMC and other semiconductor companies
  • 0

Nikkei: Japanese authorities to allocate $5.2 billion to fund TSMC and other semiconductor companies

SemiMediaEdit
November 25, 2021

According to Nikkei Asia, the Japanese government will allocate about 600 billion yen (approximately $5.2 billion) in 2021 to support semiconductor manufacturers to expand production in Japan, two-thirds of which will invest in TSMC’s chip fab in Japan.

The report pointed out that of the 600 billion yen, 400 billion yen (approximately $3.47 billion ) will be used to invest in TSMC’s manufacturing plant in Kumamoto Prefecture, Kyushu, and the remaining 200 billion yen will be used to fund other semiconductor investment projects, including Micron Technology and Kioxia Holdings.

Nikkei Asia also pointed out that because TSMC has the world's most advanced chip manufacturing technology, the Japanese government has been trying to attract TSMC to build factories in recent years. In addition, the 600 billion yen fund covers several years of subsidies, not one year.

TSMC has announced earlier this month that it will invest 7 billion US dollars to jointly establish a chip factory in Japan with Sony. It plans to start construction in 2022 and start mass production in 2024. The fab will mainly produce chips using 22nm to 28nm technology, which are widely used in the automotive and consumer electronics fields.

Related

electronic components news Nikkei Asia TSMC Japan
STMicroelectronics expands connectivity for smart-Metering applications with FCC certification of G3-PLC hybrid chipset
Previous
Samsung develops MLCC for 5G base stations
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay launches 3000W TVS diodes for automotive and industrial systems

Vishay launches 3000W TVS diodes for automotive and industrial systems

May 15, 2026
0
Japan power chip alliance talks slow as Rohm resists integration

Japan power chip alliance talks slow as Rohm resists integration

May 15, 2026
0
SEMI Says Global Semiconductor Materials Market Reaches $73.2 Billion

SEMI Says Global Semiconductor Materials Market Reaches $73.2 Billion

May 14, 2026
0
Diodes launches PCIe 7.0 clock generator for AI servers

Diodes launches PCIe 7.0 clock generator for AI servers

May 14, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator