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Home › MarketWatch › Sony Semiconductor and TSMC jointly announce to build a fab in Japan
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Sony Semiconductor and TSMC jointly announce to build a fab in Japan

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November 11, 2021

On November 9, Sony Semiconductor Solutions Corporation (SSS) and TSMC jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (JASM) in Kumamoto Prefecture, Japan, which will provide Initial technology for 22nm and 28nm processes.

JASM's wafer fab is scheduled to break ground in 2022 and start production at the end of 2024. After the factory is put into operation, it will provide about 1,500 jobs locally, with an estimated monthly production capacity of 45,000 12-inch wafers.

Sony Semiconductor Solutions plans to invest approximately $500 million in JASM, which will account for less than 20% of the shares of JASM.

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