SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Sony Semiconductor and TSMC jointly announce to build a fab in Japan
  • 0

Sony Semiconductor and TSMC jointly announce to build a fab in Japan

SemiMediaEdit
November 11, 2021

On November 9, Sony Semiconductor Solutions Corporation (SSS) and TSMC jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (JASM) in Kumamoto Prefecture, Japan, which will provide Initial technology for 22nm and 28nm processes.

JASM's wafer fab is scheduled to break ground in 2022 and start production at the end of 2024. After the factory is put into operation, it will provide about 1,500 jobs locally, with an estimated monthly production capacity of 45,000 12-inch wafers.

Sony Semiconductor Solutions plans to invest approximately $500 million in JASM, which will account for less than 20% of the shares of JASM.

Related

electronic components news
Vishay launches compact size haptic feedback actuators, providing high force density, high definition capability and compact size for touch screens, simulators and joysticks
Previous
IC Insights:DRAM prices expected to retreat in 4Q21
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Tower Semiconductor confirms it exited India fab project months ago

Tower Semiconductor confirms it exited India fab project months ago

May 20, 2025
0
TSMC plans wafer price hike, gains Nvidia’s support amid rising AI chip complexity

TSMC plans wafer price hike, gains Nvidia’s support amid rising AI chip complexity

May 20, 2025
0
Renesas launches RZ/A3M MPU with integrated memory for low-cost, high-performance HMI systems

Renesas launches RZ/A3M MPU with integrated memory for low-cost, high-performance HMI systems

May 20, 2025
0
TDK to accelerate silicon battery shipments for slimmer AI smartphones

TDK to accelerate silicon battery shipments for slimmer AI smartphones

May 19, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator