SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ROHM and Zhenghai Group announce a joint venture in SiC power module business
  • 0

ROHM and Zhenghai Group announce a joint venture in SiC power module business

SemiMediaEdit
October 26, 2021

ROHM Co., Ltd. (ROHM) and Zhenghai Group Co., Ltd. (Zhenghai Group) have signed a joint venture agreement to establish a new company in the power module business.


The new company, “HAIMOSIC (SHANGHAI) CO.,LTD.” is scheduled to be established in China in December 2021, and will be owned 80% by Shanghai Zhenghai Semiconductor Technology Co., Ltd. (Zhenghai Semiconductor) of Zhenghai Group and 20% by ROHM.

The new company will engage in the joint venture business of development, design, manufacturing and sales of power modules using silicon carbide (SiC) power devices, with the aim of developing a power module business that is ideal for traction inverters and other applications in new energy vehicles. The agreement enables to develop highly efficient power modules by combining the inverter technology of the Zhenghai Group companies, the module technology of both companies, and ROHM's cutting-edge SiC chips.

The module products to be developed through the new company are already scheduled to be used in electric vehicles, and mass production will begin from 2022.

Related

electronic components news ROHM Zhenghai Group
Renesas announces development of next-generation wireless MCU supporting new Bluetooth 5.3 low power specification
Previous
ADI sells its Symeo radar division to indie Semiconductor
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator