SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases new miniaturized, common-mode filters for high-temperature automotive applications
  • 0

TDK releases new miniaturized, common-mode filters for high-temperature automotive applications

SemiMediaEdit
September 9, 2021

TDK recently introduced the KCZ1210AH series of miniaturized common-mode filters for automotive applications. The series is extremely compact, measuring 1.25 (L) x 1.0 (W) x 0.5 mm (H), which contributes to a smaller footprint on substrate and provides a noise control function for different transmission signal lines for automobiles.

With an increase in advanced driver-assistance systems (ADAS), demands for automotive cameras are rapidly growing. Forward sensing cameras and cameras for around view monitors utilize common-mode filters as anti-noise products. However, as the conventional multilayer common-mode filter operates within a temperature range of -40 and +105℃, it cannot be used for ADAS cameras and was principally used in automotive accessories.

TDK's series uses proprietary materials technology and structural design to achieve a temperature range from -55 to +125℃; it also has a rated current max of 100 and a rated voltage max of 5. By adopting a conductive resin-based electrode, it controls product cracks due to thermal shock and increases durability against mechanical stresses, such as substrate strains.

Mass-production of this series will begin in September 2021. For more information, click KCZ1210AH.

Related

electronic components news KCZ1210AH TDK
ROHM establishes strategic partnership with Geely Auto on SiC power devices
Previous
SEMI: Global semiconductor equipment sales in the second quarter increased by 48% year-on-year
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator