SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Packaging and testing factory in mainland China are strengthening QFN packaging capabilities for automotive chips
  • 0

Packaging and testing factory in mainland China are strengthening QFN packaging capabilities for automotive chips

SemiMediaEdit
August 25, 2021

According to reports citing industry sources, mainland China's semiconductor packaging and testing service providers such as JCET, Tongfu Microelectronics, and Huatian Technology are working to improve QFN (Quad Flat No-leads Package) packaging capabilities for automotive chips.

QFN packaging is cost-effective and can be used to replace BGA and QFP packaging. It is becoming a key technology for packaging automotive chips and other mature chips.

The report pointed out that the QFN technology of JCET has been verified to be used in the motion sensors for vehicle safety system and driving stability test system, and is currently in mass production.

Related

electronic components news
ADI and Maxim announce China antitrust clearance for combination
Previous
SEMI: North American semiconductor equipment shipments in July increased 49.8% year-on-year
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

July 4, 2025
0
TSMC exits GaN foundry business as Navitas shifts to PSMC

TSMC exits GaN foundry business as Navitas shifts to PSMC

July 4, 2025
0
Intel shifts foundry focus to 14A process

Intel shifts foundry focus to 14A process

July 3, 2025
0
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

July 3, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator