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Winbond: Production capacity remains tight

SemiMediaEdit
August 17, 2021

According to reports, Arthur Chiao, chairman and CEO of the memory chip manufacturer Winbond, pointed out that the production capacity in the third quarter was in short supply, and the fourth quarter is expected to be the same.

Pei-Ming Chen, president of Winbond, emphasized that the overall market demand is still very strong. Even if new capacity is released in the DRAM market next year, it will be for DDR4 or DDR5. The demand for DDR3 will not decrease in a short time.

In addition, Arthur Chiao revealed that after Winbond’s new fab in Kaohsiung is put into operation, the annual output will grow by 15-20% in the future, which will be able to meet more customer needs.

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