SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Winbond: Production capacity remains tight
  • 0

Winbond: Production capacity remains tight

SemiMediaEdit
August 17, 2021

According to reports, Arthur Chiao, chairman and CEO of the memory chip manufacturer Winbond, pointed out that the production capacity in the third quarter was in short supply, and the fourth quarter is expected to be the same.

Pei-Ming Chen, president of Winbond, emphasized that the overall market demand is still very strong. Even if new capacity is released in the DRAM market next year, it will be for DDR4 or DDR5. The demand for DDR3 will not decrease in a short time.

In addition, Arthur Chiao revealed that after Winbond’s new fab in Kaohsiung is put into operation, the annual output will grow by 15-20% in the future, which will be able to meet more customer needs.

Related

electronic components news Winbond
Nexperia successfully completes acquisition of Newport Wafer Fab
Previous
Microchip's mid-range FPGAs reach the next power and performance milestone for edge compute systems
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

DRAM pauses after rally as NAND extends gains, Q2 rebound expected

DRAM pauses after rally as NAND extends gains, Q2 rebound expected

April 2, 2026
0
Infineon launches TLVR power module for AI server power demand

Infineon launches TLVR power module for AI server power demand

April 2, 2026
0
Fujitsu, Rapidus team up on 1.4nm AI chip for servers

Fujitsu, Rapidus team up on 1.4nm AI chip for servers

April 2, 2026
0
South Korea sees helium supply stable through June despite concerns

South Korea sees helium supply stable through June despite concerns

April 1, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Electronic components distributor
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator