SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Yageo and Foxconn announce strategic partnership
  • 0

Yageo and Foxconn announce strategic partnership

SemiMediaEdit
September 29, 2020

Yageo and Foxconn jointly announced a strategic partnership yesterday. The two parties will formally cooperate on the R&D capabilities and technological innovation of key components this quarter. In addition, the cooperation will also strengthen Foxconn’s 3+3 development strategy.

Foxconn’s 3+3 development strategy refers to the three emerging industries of electric vehicles, digital health, and robotics, as well as the three new technology fields of artificial intelligence, semiconductors, and new-generation communication technologies.

Yageo and Foxconn emphasized that the cooperation between the two parties will get rid of the traditional supply chain operation mode. The development of key components and the sharing of R&D resources, cooperation with global end customers, and Yageo’s diversified high-end products can be fully integrated with Foxconn’s 3+3 development strategy.

After acquiring KEMET and Pulse, Yageo has enriched its product line and expanded its customer range. In addition, its Tong Hsing Electronic's advanced manufacturing process in special semiconductor packaging and testing, its Chilisin's automotive inductors, magnetic materials, and Jamicon/Teapo's aluminum electrolytic capacitors and other one-stop supply services will become Foxconn's best strategic partner for development in the 3+3 field.

People familiar with the matter disclosed that in this cooperation, Yageo made certain guarantees on prices and delivery, while Foxconn promised to give priority to using Yageo’s products in certain productions.

Related

electronic components news Foxcon Yageo
Vishay releases 200 V N-Channel MOSFET in PowerPAK® 1212 8S offers industry-low RDS(ON) to increase power density and save energy
Previous
Vishay releases 200 V N-Channel MOSFET in PowerPAK® 1212 8S offers industry-low RDS(ON) to increase power density and save energy
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

SK hynix says memory market turns seller-driven, prices seen rising through 2026

SK hynix says memory market turns seller-driven, prices seen rising through 2026

February 24, 2026
0
Vishay rolls out AEC-Q200 0201 thick film resistors for auto designs

Vishay rolls out AEC-Q200 0201 thick film resistors for auto designs

February 24, 2026
0
GlobalFoundries, Renesas expand chip manufacturing partnership

GlobalFoundries, Renesas expand chip manufacturing partnership

February 24, 2026
0
Nexperia secures $60 million loan from Invest International for global capacity expansion

Nexperia secures $60 million loan from Invest International for global capacity expansion

February 23, 2026
0
2
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator