SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon launches extremely small power-saving 3D magnetic sensors to provide engineers with new design options
  • 0

Infineon launches extremely small power-saving 3D magnetic sensors to provide engineers with new design options

SemiMediaEdit
July 21, 2020

Infineon Technologies AG announced and demonstrated a 3D magnetic sensor suitable for industrial and consumer applications at its in-house digital trade show "Virtual Sensor Experience": TLI493D-W2BW.

Due to the small WLB-5 package (1.13 mm x 0.93 mm x 0.59 mm) and its low current consumption of 7 nA in power-down mode, the new magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions. Magnetic sensors offer numerous advantages here, such as their high accuracy or robustness against dust and moisture. In addition, magnetic sensors are easier to assemble and offer more design options.

In particular, the low height of the TLI493D-W2BW is helpful in extremely space-critical applications such as BLDC commutation in micromotors or control elements such as joysticks or game consoles. It enables designs with double-sided PCBs or positioning of the sensor between two PCBs. This allows optimal use of the available space; for example, additional components can be placed above the sensor.

The new sensor has an integrated wake-up function. It is available in four variants with preconfigured standard addresses. A higher resolution (typ. 32.5 to 130 µT/LSB12) compared to the previous generation extends the range of applications. XY angle measurement is also supported.

The update rate is up to 5.7 kHz (8.4 kHz for XY), while the resolution in low-power modes can be adjusted in eight steps between 0.05 and 770 Hz. Power consumption in power-down mode is specified at 7 nA. The supply current is 3.4 mA. The sensor has an I2C interface and a dedicated interrupt pin.

Availability

Samples of the new XENSIV 3D sensor TLI493D-W2BW are already available. Series production will start in August 2020. Further information is available at www.infineon.com/3dmagnetic.

 

Related

3D magnetic sensor electronic components news Infineon TLI493D-W2BW
STM announced the acquisition of two wireless technology companies to enhance the wireless connectivity capabilities of STM32 MCUs
Previous
IC Insights: Global IC market will grow this year
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

July 4, 2025
0
TSMC exits GaN foundry business as Navitas shifts to PSMC

TSMC exits GaN foundry business as Navitas shifts to PSMC

July 4, 2025
0
Intel shifts foundry focus to 14A process

Intel shifts foundry focus to 14A process

July 3, 2025
0
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

July 3, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator