SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon introduces new 600 V CoolMOS™ PFD7 series for next level of ultrahigh power-density designs
  • 0

Infineon introduces new 600 V CoolMOS™ PFD7 series for next level of ultrahigh power-density designs

SemiMediaEdit
February 14, 2020

Infineon Technologies AG announces the expansion of its CoolMOS™ portfolio with the PFD7 product family, combining best-in-class performance with state-of-the-art ease of use. The device is suitable for ultra-high power density designs such as chargers and adapters, as well as low-power drivers and specific lighting applications.

Robustness and reliability gains together with increased efficiency, minimized switching losses and improved thermal behavior make this product family the ultimate choice for contemporary engineering designs. The CoolMOS PFD7 series supports the key trends of small and light mobile products and energy saving in major home appliances pushing the limits of affordable ultrahigh power-density. The devices are optimized for high efficiency, especially at light-load conditions and still being able to fulfill EMI requirements.

These switches offer best-in-class figures-of-merit R DS(on) x Q RR. The excellent commutation ruggedness is enabled by the integrated fast body diode. The implemented Zener diode supports electrostatic discharge (ESD) protection up to 2 kV. Infineon offers a great variety of R DS(on) values ranging from 125 mΩ to 2000 mΩ. The broad package portfolio makes it easy to select the right parts for design fine-tuning to improve customers’ convenience.

 

Availability

The CoolMOS PFD7 series is now available. More information can be found under www.infineon.com/pfd7-600v.

 

Related

CoolMOS electronic components news Infineon PFD7 series
KoreaBusiness: Coronavirus is hitting memory chip industry
Previous
Renesas Electronics collaborates with Panthonics on wireless charging and connected IoT solutions
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Nexperia secures $60 million loan from Invest International for global capacity expansion

Nexperia secures $60 million loan from Invest International for global capacity expansion

February 23, 2026
0
Murata considers raising premium MLCC prices in response to AI demand surge

Murata considers raising premium MLCC prices in response to AI demand surge

February 23, 2026
0
Western Digital speeds deleveraging with SanDisk share sale

Western Digital speeds deleveraging with SanDisk share sale

February 19, 2026
0
UK chip startup Fractile to invest £100m to scale AI hardware production

UK chip startup Fractile to invest £100m to scale AI hardware production

February 18, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator