SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Samsung Electronics to invest another $ 8 billion in Chinese chip fabs
  • 0

Samsung Electronics to invest another $ 8 billion in Chinese chip fabs

SemiMediaEdit
December 13, 2019

According to reports, Samsung Electronics will invest $ 8 billion in its chip factory in China to promote the production of NAND flash memory chips. According to industry estimates, due to limited supply and rising demand for 5G equipment and networks, the global memory chip market will rebound next year, and Samsung's investment comes at a time when the global memory market is expected to rebound next year.

Prior to this, Samsung earlier invested $ 10.8 billion in a testing and packaging factory in Xi'an, China, for the first phase of Samsung's Xi'an flash chip project. The $ 8 billion investment is the second investment in Samsung’s Xi'an Phase II flash memory chip project. The total investment for the second phase of the project is US $ 15 billion, divided into two investments, the first US $ 7 billion and the second US $ 8 billion.

The second-phase project is expected to be completed in the second half of 2021. After the completion, it will add 130,000 pieces of monthly production capacity and an additional output value of about 30 billion yuan.

Related

electronic components news Samsung Electronics Samsung Xi’an fabs
USI intends to acquire Asteelflash, the second largest EMS company in Europe
Previous
Mouser Electronics adds new features to its website to simplify engineers' work
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

April 21, 2026
0
Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output

Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output

April 21, 2026
0
Shin-Etsu to raise silicone prices as costs pressure semiconductor materials

Shin-Etsu to raise silicone prices as costs pressure semiconductor materials

April 21, 2026
0
UMC plans wafer price hikes in second half as demand stays firm

UMC plans wafer price hikes in second half as demand stays firm

April 20, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator