SK Hynix's new chip packaging & testing base will be put into production in September
According to SK Hynix China, its chip packaging project (Phase II Project) in Chongqing will be put into operation in September after the equipment is commissioned and commissioned.
On May 10, 2013, SK hynix Semiconductor signed an agreement with Chongqing Municipal Government of China to establish SK Hynix Semiconductor (Chongqing) Co., Ltd. to invest in the construction of NAND Flash memory chip packaging and testing production line, responsible for semiconductor post-processing services, Including the construction of chip packaging, testing, modules and other production lines.
At present, the packaging and testing are carried out in the first phase of the project. After the completion of the second phase, the first phase of the project will focus on the testing process, while the second phase will focus on the packaging process.
It is reported that the second phase of the SK hynix Chongqing project has a total investment of 1.2 billion US dollars. After the completion of the second phase of the project, the combined capacity of the first phase and the second phase will be 2.5 times the existing capacity. The annual production of chips will be close to 2 billion. By then, Chongqing's annual production of chips will account for more than 40% of the entire SK hynix flash memory products, becoming Hynix's largest overseas packaging and testing base.