SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Murata, NXP and Cypress collaborate to develop multi-platform Wi-Fi IoT solutions
  • 0

Murata, NXP and Cypress collaborate to develop multi-platform Wi-Fi IoT solutions

SemiMediaEdit
February 26, 2019

Murata has partnered with NXP Semiconductors and Cypress Semiconductor to provide IoT developers with hybrid wireless connectivity and processing solutions designed to help reduce time-to-market for related products, including battery-powered IoT devices and for connected cars. Industrial equipment and subsystems.

These solutions combine Murata's industry-leading wireless modules with Cypress's powerful Wi-Fi and Bluetooth portfolio and the NXP i.MX family of processors.

These solutions provide developers with a wide range of scalable processing platforms, including i.MX 6, i.MX 7 and i.MX 8 series application processors and i.MX RT cross processors. The Murata solution provides the device with the flexibility of an easy-to-use M.2 connector. Cypress's Wi-Fi/Bluetooth connectivity solutions include 1x1 802.11bgn, 802.11abgn and 802.11ac, up to 2x2 802.11ac, and Bluetooth 5.0.

Murata works closely with NXP and Cypress to ensure that each hardware platform and corresponding software is validated to simplify the design cycle.

Related

Cypress Semiconductor Electronic component news Hybrid wireless connectivity and processing solutions i.MX 6 i.MX 7 i.MX 8 i.MX RT IoT devices M.2 connector Murata NXP Semiconductors
5G will drive the global demand for power amplifiers by 32 to 64 times, and ST and Macom work together to accelerate support.
Previous
Infineon, Xilinx and Xylon jointly develop new MCU solutions for security applications
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

September 16, 2025
0
Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market

Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market

September 15, 2025
0
Kioxia to commercialize AI SSDs by 2027 in collaboration with Nvidia

Kioxia to commercialize AI SSDs by 2027 in collaboration with Nvidia

September 12, 2025
0
Nexperia launches AEC-Q100 multiplexers to boost reliability in automotive systems

Nexperia launches AEC-Q100 multiplexers to boost reliability in automotive systems

September 10, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator