SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Samsung will supply V9 chips for Audi cars
  • 0

Samsung will supply V9 chips for Audi cars

SemiMediaEdit
January 4, 2019

According to reports, Samsung will provide Audi's next-generation in-vehicle infotainment system with the latest 8nm V9 processor.

The Samsung Exynos Auto V9 includes eight ARM Cortex-A76 cores with a maximum processing speed of 2.1 GHz and will be unveiled in 2021.

At the same time, the Samsung V9 chip is designed for advanced infotainment systems that display content on multiple screens, supporting up to six displays and 12 camera connections for various subsystems.

In addition, the 8nm V9 will be compatible with ARM Mali G76 GPUs, HiFi 4 audio digital signal processors and intelligent neural processing units, support for LPDDR4 and LPDDR5 DRAM, and support for the Automotive Safety Integrity Level (ASIL)-B standard.

Last October, Samsung launched three separate Exynos brands Exynos Auto V, Exynos Auto A and Exynos Auto T for its future car chips. V is used for infotainment, A is used for advanced driver assistance systems, and T is used for telematics.

Related

Audi electronic components news SAMSUNG V9 chips
TI and Mouser collaborate to launch e-books on op-amps
Previous
u-blox | Takes you beyond expectations
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

South Korea pushes SiC and GaN power chips in foundry drive

South Korea pushes SiC and GaN power chips in foundry drive

January 15, 2026
0
SK hynix plans advanced packaging plant in Cheongju for HBM production

SK hynix plans advanced packaging plant in Cheongju for HBM production

January 15, 2026
0
Microchip launches military-grade plastic TVS devices for aerospace use

Microchip launches military-grade plastic TVS devices for aerospace use

January 15, 2026
0
Diodes targets wearables with ultra-low IQ synchronous buck converters

Diodes targets wearables with ultra-low IQ synchronous buck converters

January 14, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator