SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK launches miniaturized, high-sensitivity MEMS pressure sensor element
  • 0

TDK launches miniaturized, high-sensitivity MEMS pressure sensor element

SemiMediaEdit
October 8, 2021

TDK Corporation recently introduced a new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35 works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V. Offering a high sensitivity of 110 mV/V/bar, C35 is well suited for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON. Furthermore, C35 is designed for a wide temperature range from -40 °C to +150 °C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.

Further information on the products can be found under: https://www.tdk-electronics.tdk.com/en/pressure_sensor_elements.

Related

B58601E35 electronic components news TDK
Qualcomm buys ADAS supplier Veoneer for $4.5 billion
Previous
TSMC and Sony considering joint chip fab
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
8-inch wafer foundry capacity tightens in 2026 as utilization rises

8-inch wafer foundry capacity tightens in 2026 as utilization rises

January 16, 2026
0
2025 semiconductor revenue reaches $793 billion as AI demand accelerates

2025 semiconductor revenue reaches $793 billion as AI demand accelerates

January 16, 2026
0
South Korea pushes SiC and GaN power chips in foundry drive

South Korea pushes SiC and GaN power chips in foundry drive

January 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator