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ST releases innovative biosensing technology to power next-generation healthcare and fitness wearables
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Toshiba aims for double-digit share in global power chip market by 2030
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TI expands internal manufacturing for GaN semiconductors, quadrupling capacity
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TSMC announces 2025 price adjustments, exceeding previous forecasts
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Infineon's CoolSiC™ Schottky diode 2000 V boosts efficiency and simplifies design in DC link systems up to 1500 VDC
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Intel expands Chengdu facility to add server chip packaging and testing
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SEMI forecasts 2% drop in global silicon wafer shipments for 2024, with 10% rebound in 2025
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Arm moves to cancel Qualcomm license, risking chip design disruption
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Vishay introduces IGBT and MOSFET drivers in stretched SO-6 package for compact designs, fast switching, and high voltages
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Insider: Wolfspeed, ZF chip project may be scrapped
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