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TI introduces new edge AI radar sensors and automotive audio processors to redefine in-cabin experiences for automakers
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Murata’s Type 1SC-NTN module achieves Skylo FCC & CE L-band Certification for cellular and non-terrestrial network connectivity
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Syntiant Completes Acquisition of Knowles Consumer MEMS Microphone Business, Expanding AI Audio Module Portfolio
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Europe’s chip share may drop to 5.9%, ZVEI urges greater investment
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South Korea's 2024 chip exports surge 43.9%
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DRAM and NAND flash prices expected to fall sharply in Q1 2025
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TSMC to expand monthly CoWoS capacity to 70,000 wafers in 2025
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Littelfuse completes acquisition of Elmos’ Dortmund wafer fab for €93 million
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Micron to invest $2.17 billion to expand DRAM production in the US
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TAIYO YUDEN launches ultra-thin 0.33 mm metal power inductor
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