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Littelfuse releases IXD2012NTR high-side and low-side gate driver for high-frequency power applications
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Samsung to end DDR4 production, shifts focus to DDR5 and HBM
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Micron forms new cloud storage unit to target AI data centers and HBM growth
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Tenstorrent to expand Japan engineering team sixfold amid chip design push
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Nexperia launches flip-chip ESD diodes for high-speed automotive interfaces
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Vishay releases 600 V standard and 60 V–200 V TMBS® rectifiers in DFN33A package with up to 9 A current rating
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Yageo raises bid for Shibaura, intensifying takeover battle with MinebeaMitsumi
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onsemi withdraws Allegro acquisition bid, shifts focus to core semiconductor growth
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TSMC to relocate 30% of advanced chip capacity to Arizona fab
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SK Hynix to expand HBM production with record investment of over $13.7 billion
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