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Japan’s electronic component shipments increased by 3% year-on-year in November 2023
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Intel delays construction of Ohio chip fab
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Murata launches new automotive-grade power inductors with improved DC resistance and current rating
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SK Hynix plans to build an advanced packaging factory in the United States, reports say
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IC design market is expected to see significant growth
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Tower Semiconductor partners with Renesas Electronics to manufacture SiGe-based beamforming ICs
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Intel announces foundry cooperation with UMC
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Diodes Inc. launches dual-channel high-side switch to provide robust protection for automotive applications
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Several new fabs in Japan are expected to start production in 2024
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Renesas launches RA8 MCUs for motor control applications
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