Electronic components

Infineon announces registration of its QDPAK and DDPAK packages as JEDEC standard for high power applications

Infineon announces registration of its QDPAK and DDPAK packages as JEDEC standard for high power applications

February 13, 2023

Renesas ramps up chip volume to support first FDA-authorized at-home test for COVID-19

Renesas ramps up chip volume to support first FDA-authorized at-home test for COVID-19

November 5, 2021

ST announces acquisition of SOMOS Semiconductor

ST announces acquisition of SOMOS Semiconductor

October 16, 2020

TDK Ventures adds AI accelerator Groq to its investment portfolio

TDK Ventures adds AI accelerator Groq to its investment portfolio

August 6, 2020

ST launches new ToF sensor to provide multi-object ranging for next-generation industrial and personal electronic applications

ST launches new ToF sensor to provide multi-object ranging for next-generation industrial and personal electronic applications

May 26, 2020

Vishay releases the latest operational status of its facilities

Vishay releases the latest operational status of its facilities

April 15, 2020

Component makers play a vital role in the fight against COVID-19

Component makers play a vital role in the fight against COVID-19

April 10, 2020

Samsung launches industry's first integrated power management chip for TWS earbuds

Samsung launches industry's first integrated power management chip for TWS earbuds

March 25, 2020

Samsung purchases 20 EUV equipment from ASML

Samsung purchases 20 EUV equipment from ASML

January 30, 2020

South Korea announces investment in next-generation semiconductor industry

South Korea announces investment in next-generation semiconductor industry

January 22, 2020