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Murata signs licensing agreement with Michelin to integrate RFID technology into tires
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SEMI: Global wafer output up by 1.4% in the second quarter
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Renesas plans to increase sales share in Indian to 10% to 15% by 2030
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Infineon launches XENSIV™ TLE49SR angle sensor family with excellent stray field robustness
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Knometa: Mainland China is expected to rank first in IC wafer output in 2026
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Vishay launches 25 MBd optocoupler with digital inputs and outputs to simplify design and reduce costs
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Abracron partners with u-blox to develop high-precision GNSS solutions
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SEMI: Chip manufacturing is improving
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Samsung and SK Hynix converts more than 20% DRAM production lines to HBM
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ST launches monolithic automotive synchronous buck converter for light-load, low-noise and isolation applications
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