Electronic components supplier

SK Siltron secures $544 million U.S. loan to boost 8-inch SiC wafer production by 2025

SK Siltron secures $544 million U.S. loan to boost 8-inch SiC wafer production by 2025

November 18, 2024

Surplus in SiC substrate market leads to significant price decline in 2024

Surplus in SiC substrate market leads to significant price decline in 2024

November 18, 2024

LG, Tenstorrent expand partnership to develop AI chips for “Affectionate Intelligence”

LG, Tenstorrent expand partnership to develop AI chips for “Affectionate Intelligence”

November 15, 2024

Nexperia’s new 120 V/4 A half-bridge gate driver raises robustness and efficiency in automotive applications

Nexperia’s new 120 V/4 A half-bridge gate driver raises robustness and efficiency in automotive applications

November 15, 2024

Akash Systems secures $18.2 million subsidy under U.S. CHIPS Act for California cleanroom facility

Akash Systems secures $18.2 million subsidy under U.S. CHIPS Act for California cleanroom facility

November 15, 2024

Allegro releases advanced magnetic and inductive position sensing solutions

Allegro releases advanced magnetic and inductive position sensing solutions

November 14, 2024

SEMI: Q3 silicon wafer shipments hit 5-quarter high, strong rebound expected in 2025

SEMI: Q3 silicon wafer shipments hit 5-quarter high, strong rebound expected in 2025

November 14, 2024

AMD to cut 4% of global workforce, aims to optimize resources amid market challenges

AMD to cut 4% of global workforce, aims to optimize resources amid market challenges

November 14, 2024

Infineon delays Kulim expansion, cuts investment as 2025 revenue outlook weakens

Infineon delays Kulim expansion, cuts investment as 2025 revenue outlook weakens

November 13, 2024

Renesas releases new AnalogPAK Programmable Mixed-Signal ICs, including first low-power device with 14-bit SAR ADC

Renesas releases new AnalogPAK Programmable Mixed-Signal ICs, including first low-power device with 14-bit SAR ADC

November 13, 2024