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NXP launches i.MX 94 processors for secure and reliable industrial and automotive edge connectivity
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ST partners with Hua Hong to produce 40nm MCU chips in China
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Infineon releases industry’s first radiation-hardened-by-design 512 Mbit QML-qualified NOR Flash for space industry applications
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AMS-Osram expands cost-cutting plan, to cut over 500 jobs
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Molex to acquire AirBorn, bolstering aerospace and defense capabilities
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Vishay releases introduces compact, sealed SMD trimmers for harsh environments
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Samsung begins equipment installation at NRD-K semiconductor R&D complex
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TDK launches second-generation 6-axis IMUs for enhanced driver assistance and safety
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TSMC plans to build 10 new fabs globally by 2025, capital expenditure to reach up to $38 billion
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NXP releases industry-first ultra-wideband wireless battery management system solution
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