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TI announces expansion of space-grade portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space
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IC Insights: 2023 semiconductor capex forecast sees biggest drop since 2008-2009
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Micron Technology begins mass production of cutting-edge DRAM in Hiroshima, Japan
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Vishay introduces AEC-Q102 qualified linear optocouplers, deliverying faster response time, higher isolation voltage and transfer gain stability
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SIA: Semiconductor demand expected to rebound in second half of 2023
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Silicon Labs issues price increase notice
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Diodes Inc. introduces PCIe 3.0 packet switch, delivering Fan-Out and Multi-Host capabilities
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TSMC is expected to win Tesla's FSD chip order
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Analog Devices announces world's first long-range SPoE solution for smart buildings and factory automation
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Micron to reduce memory chip supply by 20%
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