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onsemi launches 8.3 MP image sensors to provide first-class dynamic range under challenging lighting conditions
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ST and Rosenberger collaborate to develop unique high-speed contactless connector based on 60GHz wireless technology
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TSMC: Chips delivered is far more than the number assembled on electronic products
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Infineon launches new EasyPACK™ 2B EDT2 power module for traction inverters with power up to 50 kW
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Renesas launches MCUs with 2x performance and over 30% better power efficiency for home and industrial applications
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Micron: Automotive and industry will be the fastest-growing markets for memory chips in the next decade
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TI plans to build a new 300mm fab
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Renesas releases industry’s highest performance entry-line MCUs
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Molex issues price increase notice
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Renesas plans to increase automotive MCU output by more than 50%
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