electronic components news

Micron plans to build a new DRAM factory in Japan
MarketWatch

Micron plans to build a new DRAM factory in Japan

October 21, 2021
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Renesas issues price increase notice
MarketWatch

Renesas issues price increase notice

October 20, 2021
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Vishay introduced high-voltage chip divider in molded package, reducing component counts and improving TC tracking performance
Distribution

Vishay introduced high-voltage chip divider in molded package, reducing component counts and improving TC tracking performance

October 20, 2021
0
SEMI: Global silicon wafer shipments are expected to grow strongly by 2024
MarketWatch

SEMI: Global silicon wafer shipments are expected to grow strongly by 2024

October 20, 2021
0
Nikkei: Renesas outsources chips finer than 40nm
MarketWatch

Nikkei: Renesas outsources chips finer than 40nm

October 19, 2021
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ST and Sierra Wireless collaborate to simplify and accelerate connected IoT solutions deployment
Manufacturer

ST and Sierra Wireless collaborate to simplify and accelerate connected IoT solutions deployment

October 19, 2021
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TSMC Arizona plans to produce 5nm chips for mobile phones from 2024
MarketWatch

TSMC Arizona plans to produce 5nm chips for mobile phones from 2024

October 19, 2021
0
TI launches industry's most accurate 3D Hall-effect position sensor, providing speed and accuracy for faster real-time control
Manufacturer

TI launches industry's most accurate 3D Hall-effect position sensor, providing speed and accuracy for faster real-time control

October 18, 2021
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SEMI: Power and compound fab capacity is expected to reach a record 10 million wafers per month in 2023
MarketWatch

SEMI: Power and compound fab capacity is expected to reach a record 10 million wafers per month in 2023

October 18, 2021
0
Bosch China: We can only meet half of the car chips demand.
MarketWatch

Bosch China: We can only meet half of the car chips demand.

October 18, 2021
0

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