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Infineon launches fifth-generation CAPSENSE™ capacitive and inductive touch-sensing HMI technology
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Reuters: Intel to invest $7 billion in new chip packaging plant in Malaysia
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ST launches new silicon carbide devices for electric vehicles and industrial applications
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Global semiconductor revenue exceeded $150 billion in Q3, said Omdia
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SFG: Chip lead time further extended in November
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TDK releases high-precision NTC chips for embedding into IGBT modules
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onsemi releases high-performance, low power-loss SUPERFET V series MOSFETs for server and telecom applications
MarketWatch
SIA urges the United States to eliminate Section 301 tariffs
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Vishay launches new IHCM common mode chokes, offering low profile, high shock and vibration resistance for 35 A commercial applications
MarketWatch
TheElec: AP and RF chip shortages will continue to affect smartphone supply next year
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