electronic components news

ST releases turnkey STGesture™ recognition for touchless control in diverse applications

ST releases turnkey STGesture™ recognition for touchless control in diverse applications

April 26, 2022

Renesas plans to expand in U.S.

Renesas plans to expand in U.S.

April 26, 2022

IC Insights: Wafer capacity expected to climb 8.7% as 10 new fabs come online

IC Insights: Wafer capacity expected to climb 8.7% as 10 new fabs come online

April 25, 2022

Infineon releases new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility

Infineon releases new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility

April 25, 2022

Counterpoint: Chip shortage may ease significantly in second half of 2022

Counterpoint: Chip shortage may ease significantly in second half of 2022

April 25, 2022

Vishay introduces new position sensor to provide high performance in miniature sizes for military and industrial applications

Vishay introduces new position sensor to provide high performance in miniature sizes for military and industrial applications

April 22, 2022

ASE invests $45.2 million to expand IC packaging and testing capacity

ASE invests $45.2 million to expand IC packaging and testing capacity

April 22, 2022

Mouser named onsemi 2021 Global High Service Distributor

Mouser named onsemi 2021 Global High Service Distributor

April 21, 2022

Murata releases metal power inductors for in-vehicle applications with significant improvements in Isat and RDC specifications

Murata releases metal power inductors for in-vehicle applications with significant improvements in Isat and RDC specifications

April 21, 2022

Winbond and Infineon collaborate on HYPERRAM 3.0 to double bandwidth for IoT applications

Winbond and Infineon collaborate on HYPERRAM 3.0 to double bandwidth for IoT applications

April 21, 2022