electronic components news

Vishay introduces thin film wraparound chip resistors, delivering up to 1 W of power and resistors from 39 Ω to 900 kΩ

Vishay introduces thin film wraparound chip resistors, delivering up to 1 W of power and resistors from 39 Ω to 900 kΩ

May 23, 2022

Nexperia and KYOCERA AVX Components Salzburg partner on GaN automotive power modules

Nexperia and KYOCERA AVX Components Salzburg partner on GaN automotive power modules

May 20, 2022

IC Insights: China-based IC production to represent 21.2% of mainland China IC market in 2026

IC Insights: China-based IC production to represent 21.2% of mainland China IC market in 2026

May 20, 2022

Diodes Inc. introduces PowerDI8080 Packaged MOSFETs, bringing higher power densities to automotive applications

Diodes Inc. introduces PowerDI8080 Packaged MOSFETs, bringing higher power densities to automotive applications

May 20, 2022

TI breaks ground on new 300mm wafer fab in Sherman, Texas

TI breaks ground on new 300mm wafer fab in Sherman, Texas

May 19, 2022

NXP plans to expand chip fab in Texas

NXP plans to expand chip fab in Texas

May 19, 2022

Infineon releases dual-channel DC-DC controller for full LED headlamps without a microcontroller

Infineon releases dual-channel DC-DC controller for full LED headlamps without a microcontroller

May 19, 2022

Microchip: Chip delivery impacted by epidemic prevention and control measures in Shanghai

Microchip: Chip delivery impacted by epidemic prevention and control measures in Shanghai

May 18, 2022

Nexperia expands portfolio of clip-bonded FlatPower packaged diodes with new automotive CFP2-HP device

Nexperia expands portfolio of clip-bonded FlatPower packaged diodes with new automotive CFP2-HP device

May 18, 2022

Renesas announces investment of 90 billion yen to increase power semiconductor capacity

Renesas announces investment of 90 billion yen to increase power semiconductor capacity

May 18, 2022