electronic components news

Renesas temporarily closes Beijing fab
MarketWatch

Renesas temporarily closes Beijing fab

December 19, 2022
0
Infineon introduces new PQFN dual-side cooling 25-150 V power MOSFETs
Manufacturer

Infineon introduces new PQFN dual-side cooling 25-150 V power MOSFETs

December 19, 2022
0
Marvell issues price increase notice
MarketWatch

Marvell issues price increase notice

December 16, 2022
0
NXP releases new secure wireless MCU to simplify smart home device design and reduce costs
Manufacturer

NXP releases new secure wireless MCU to simplify smart home device design and reduce costs

December 16, 2022
0
SEMI: 84 chip manufacturing facilities will be added worldwide from 2021 to 2023
MarketWatch

SEMI: 84 chip manufacturing facilities will be added worldwide from 2021 to 2023

December 16, 2022
0
The Elec: Operating rate of Korean wafer fabs dropped sharply to 80% in Q4
MarketWatch

The Elec: Operating rate of Korean wafer fabs dropped sharply to 80% in Q4

December 15, 2022
0
Nexperia introduces new ESD protector for high speed data lines
Manufacturer

Nexperia introduces new ESD protector for high speed data lines

December 15, 2022
0
IBM announces cooperation with Japanese chipmaker Rapidus
MarketWatch

IBM announces cooperation with Japanese chipmaker Rapidus

December 14, 2022
0
TDK releases ultra-low ESL high-frequency DC link capacitor
Manufacturer

TDK releases ultra-low ESL high-frequency DC link capacitor

December 14, 2022
0
Samsung: 3nm foundry market is expected to reach $24.2 billion in 2026
MarketWatch

Samsung: 3nm foundry market is expected to reach $24.2 billion in 2026

December 13, 2022
0

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