electronic components news

Infineon launches new Bluetooth LE SoC, supports latest bluetooth 5.4 specification
Manufacturer

Infineon launches new Bluetooth LE SoC, supports latest bluetooth 5.4 specification

March 27, 2023
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ROHM announces ultra-high speed control IC technology
MarketWatch

ROHM announces ultra-high speed control IC technology

March 24, 2023
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ST releases first AI-enhanced smart accelerometer, improving performance and efficiency for always-aware applications
MarketWatch

ST releases first AI-enhanced smart accelerometer, improving performance and efficiency for always-aware applications

March 24, 2023
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Vishay expands chip fab in Schleswig-Holstein, Germany
MarketWatch

Vishay expands chip fab in Schleswig-Holstein, Germany

March 24, 2023
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Renesas announces acquisition of Panthronics
MarketWatch

Renesas announces acquisition of Panthronics

March 23, 2023
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Magnachip is said to cut 5% jobs
MarketWatch

Magnachip is said to cut 5% jobs

March 23, 2023
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Nexperia's new hotswap application-specific MOSFETs offers 60% smaller footprint
Manufacturer

Nexperia's new hotswap application-specific MOSFETs offers 60% smaller footprint

March 23, 2023
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SEMI: Global fab equipment spending expected to recover in 2024
MarketWatch

SEMI: Global fab equipment spending expected to recover in 2024

March 22, 2023
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Diodes Inc. releases 20Gbps 2x2 switch for fast multiplexing/switching in automotive media and driver assistance systems
Manufacturer

Diodes Inc. releases 20Gbps 2x2 switch for fast multiplexing/switching in automotive media and driver assistance systems

March 22, 2023
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Tokyo Electronics to build a new semiconductor equipment factory in Japan
MarketWatch

Tokyo Electronics to build a new semiconductor equipment factory in Japan

March 22, 2023
0

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