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Renesas announces joint venture to to build OSAT facility in India
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Nexperia expands its range of discrete FET solutions
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Infineon announces restructuring of sales and marketing
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Murata announces absorption-type merger
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TI lays off power chip R&D team in Beijing
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Vishay launches IGBT power modules in redesigned INT-A-PAK package that reduces conduction and switching losses
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Broadcom to sell remote access business, report says
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Analog Devices announces expansion of wafer supply partnership with TSMC
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U.S. aims to produce 20% of the world's cutting-edge chips by 2030
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TDK releases new inductor for automotive high-frequency circuits
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