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electronic components news
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Samsung boosts GDDR6 output for Tesla as auto memory demand rises
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Tesla plans $3 billion chip R&D fab in Texas, eyes Terafab project
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SK hynix starts advanced packaging plant in Cheongju to boost HBM supply
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TSMC targets 2029 advanced packaging plant in Arizona to support AI demand
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AMD taps GlobalFoundries for MI500 photonics as it advances CPO design
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Microchip launches CLB MCUs to improve timing control and cut system cost
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EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem
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Samsung targets May samples for HBM4E, eyes Nvidia AI demand
MarketWatch
Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output
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Shin-Etsu to raise silicone prices as costs pressure semiconductor materials
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