According to OSATs and chip packaging material suppliers in the semiconductor supply chain, demand for automotive MCUs and MPUs is still on the rise.

Leading OSAT companies, including ASE, have secured orders for automotive MCU back-end outsourcing for the next two quarters from international IDM companies, the source said.

Sources said that back-end suppliers found that IDMs have become cautious about their business prospects in the second half of 2023 when they negotiated orders for 2023 with IDMs in the United States, Japan and Europe.

The source also revealed that automotive chip IDM is expected to slightly reduce its outsourcing back-end orders in the second half of 2023, but it is uncertain whether the demand for automotive MCUs and MPUs will reverse in the second half of next year.