SIA: Global semiconductor sales increased 18.3% year-on-year in the second quarter

SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

onsemi expects to produce 200mm SiC wafers by 2025

AMD expects AI chip supply to be tight until 2025

Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery

SemiMedia - Electronic Component Industry News & Insights

Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications
Manufacturer

Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications

September 9, 2019
0
ON Semiconductor Supports Increasing Power Demands of IoT Endpoints with New Power over Ethernet (PoE) Solutions
Manufacturer

ON Semiconductor Supports Increasing Power Demands of IoT Endpoints with New Power over Ethernet (PoE) Solutions

September 9, 2019
0
Nexperia secures $1,500M financing to fund future growth plans
Manufacturer

Nexperia secures $1,500M financing to fund future growth plans

September 6, 2019
0
Nordic Semiconductor expands distribution network in India
Distribution

Nordic Semiconductor expands distribution network in India

September 6, 2019
0
Korean media: SK Hynix Wuxi Plant has completely used hydrogen fluoride produced in China
Distribution

Korean media: SK Hynix Wuxi Plant has completely used hydrogen fluoride produced in China

September 5, 2019
0
TSMC takes half of the global market share of foundry business
MarketWatch

TSMC takes half of the global market share of foundry business

September 5, 2019
0
Samsung released its first 5G mobile SoC with support for 108 million pixel sensors
Manufacturer

Samsung released its first 5G mobile SoC with support for 108 million pixel sensors

September 4, 2019
0
SEMI: 300mm fab equipment spending will show strong growth in the next 5 years
MarketWatch

SEMI: 300mm fab equipment spending will show strong growth in the next 5 years

September 4, 2019
0
Infineon | LDS 2.0 – the future of electronic passports
Video

Infineon | LDS 2.0 – the future of electronic passports

September 4, 2019
0
NXP | Smart Personal Healthcare With NXP's NTAG SmartSensor
Video

NXP | Smart Personal Healthcare With NXP's NTAG SmartSensor

September 3, 2019
0

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